PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment utilizes an RF electric field to excite process gases into a plasma state, enabling reactant gases—such as silane (SiH4), ammonia (NH3), and nitrous oxide (N2O)—to undergo chemical reactions and deposit films at low temperatures; it is widely used for the fabrication of dielectric and functional thin films on 8-inch wafers.

The system comprises a main chamber (PECVD reaction chamber) and a secondary chamber (sample loading chamber/load lock), utilizing a combination of turbomolecular and mechanical pumps for rapid vacuum evacuation. It integrates five major subsystems—gas delivery, pneumatic pressure control valves, vacuum systems, electrical controls, and water cooling—supporting processes with a 350°C temperature ramp and offering a controllable deposition rate range of 0.1–5 nm/s.

Technical Specifications
♦ Wafer-to-wafer thickness uniformity: ≤±3% (excluding the 3–5 mm edge exclusion zone)
♦ Within-wafer thickness uniformity: ≤±3% (excluding the 3–5 mm edge exclusion zone)
♦ Deposition rate: Controllable range of 0.1–5 nm/s
♦ Product size: 8-inch wafer; downward compatible (using 8-inch wafer as carrier); tolerance ±0.25 mm
♦ Product thickness: <1.1 mm (customizable per client requirements)
♦ Vacuum chamber and piping leak rate: 1×10⁻⁶ Torr•L/s
♦ Dry pump ultimate pressure: ≤1×10⁻³ Torr
♦ Pump-down time: <30 min to reach operating vacuum
♦ Equipment surface temperature: External surface temperature ≤60°C during normal operation
♦ Process temperature: Wafer temperature reaches up to 350°C during processing; supports ramped heating
♦ Temperature stability: Heating plate uniformity ±3%
♦ Wafer temperature uniformity: ≤±1% (up to 300°C); ≤±3% (300–350°C)
♦ RF power supply: 13.56 MHz; 1kW RF power (continuously adjustable); capacitive matching network
♦ Wafer handling: Manual loading/unloading at the TM (Transfer Module) chamber; automatic transfer between TM chamber and PVD chamber via robotic arm
♦ Process gas flow meters: Equipped with flow meters of appropriate ranges