MF(Medium Frequency) Unbalanced Magnetron Sputtering Sources

Description

Unbalanced magnetron sputtering technology is to adjust the magnetic flux of the inner and outer magnetic poles of the magnetron sputtering cathode, so that the magnetic flux of the outer magnetic pole is greater than that of the inner magnetic pole, resulting in incomplete closure of the magnetic lines of force of the two poles on the target surface. A portion of the magnetic field lines may extend into the substrate region along the edge of the target, such that a portion of the electrons may extend into the substrate along the magnetic field lines, increasing the plasma density and gas ionization rate in the substrate region. This sputtering technique can more effectively use the magnetic field to confine the charged particles and improve the sputtering efficiency and coating quality. 

Name:             Twin (Medium frequency) MF magnetron sputtering for PVD coating
Type:               Rotary cylindrical sputtering cathodes or planar 
Application:    For magnetron sputtering deposition
Size:                Customized

(Mid-frequency magnetron sputtering installed in a PVD coating system)

Design advantages

Improve coating quality: Unbalanced magnetron sputtering technology can increase the plasma density and gas ionization rate in the substrate area, thereby improving the quality and uniformity of the coating.

Improve the sputtering efficiency: due to the extension of the magnetic field lines, more electrons can participate in the sputtering process, thereby improving the sputtering efficiency.

Expand the scope of application: Unbalanced magnetron sputtering technology is suitable for coating a variety of materials, including metals, alloys, compounds, etc., with a wide range of applications.

This coating technolgy can be used for applying different decorative PVD colors including very dark black on substrates. It does not produce too much heat during the vacuum sputtering process, so it is appliable for different base materials, such as plastic, stainless steel, ceramic, glass, etc.

  • Up to 80% Target Utilization – Dramatically reduces material costs and minimizes target waste

  • Continuous Stable Discharge – No racetrack erosion groove, ensuring consistent process stability

  • Higher Power Density – Enables increased deposition rates for higher throughput

  • Reduced Arcing – Smoother operation when used with MF power supplies

  • Ideal for Reactive Processes – Excellent performance in DC/MF sputtering of oxides, nitrides, carbides, and other dielectric materials

  • Flexible Adjustment – Easy parameter tuning by adjusting magnet assembly position and mounting configuration

Applications

The Cylindrical MF Magnetron Sputtering Cathode is widely used in various thin-film preparation fields:

  • Large-area glass coating – Low-E glass, solar control coatings, anti-reflective coatings

  • Web/roll-to-roll coating – Flexible electronics, packaging films, barrier layers

  • Decorative & functional coatings – TiN, CrN, ZrN, DLC, Al₂O₃, SiO₂

  • Reactive sputtering of dielectrics – Using MF power for stable reactive processes

  • Semiconductor & optical coatings – With clean design options for contamination-sensitive applications

  • Solar cells & display manufacturing – High-quality, uniform films for optoelectronic devices