Laboratory Small-Scale Small Magnetron Sputtering Systems
Small magnetron sputtering systems are compact and have a small footprint, allowing them to be easily embedded in laboratory corners or small-scale production lines, eliminating the need for separate site planning. Its modular design supports flexible deployment and adapts to different space needs.
Features:
Target compatibility: Supports 2-inch to 6-inch targets, covering copper, aluminum, titanium, tin oxide and other metal and ceramic targets.
Process mode: Provides direct current (DC), radio frequency (RF), and Pulsed DC modes, suitable for conductive/non-conductive material deposition.
Reactive sputtering: supports the preparation of compound thin films such as nitrides and oxides (such as TiN, SiO ₂).
Main configurations:
Vacuum system: turbomolecular pump + mechanical pump, ultimate vacuum ≤ 5 × 10 ⁻ ⁵ Pa, up to 10 ⁻ ³ Pa in 15 minutes.
Heating sample stage: the maximum temperature is 600 ℃, and the rotation rate is adjustable.
Power configuration: DC/MF power supply, optional RF radio frequency power supply (13.56 MHz), support multi-target and co-sputtering.
Vacuum chamber design: stainless steel vacuum chamber+ glass observation window, with water cooling/heating function, suitable for high and low temperature processes.
Control system: automatic control, supporting process parameter preset, data recording and multi-level safety interlocking.
Applicable customers:
1. Small batch production
2. Scientific research and innovation
3. Laboratory Materials Engineering