Upgrade your thin-film manufacturing process with our advanced Magnetron Sputtering System, engineered specifically for high-adhesion metal coating on ceramic substrates. Whether you need copper, chromium, titanium, or multi-layer composites, our system delivers atomic-level precision, unmatched uniformity, and industrial-grade reliability.

Features:

Feature Benefit
Multi-Target Capability Deposit copper, chromium, nickel, titanium, silver, and alloys in a single cycle. Perfect for complex layer structures.
High Uniformity Achieve film thickness uniformity of ≤ ±5% across 4-6 inch ceramic wafers or large substrates.
Strong Adhesion Plasma pre-treatment and DC/RF sputtering ensure excellent bonding strength on alumina (Al₂O₃), aluminum nitride (AlN), and other ceramic surfaces.
Full Automation PLC/HMI touch screen control with recipe storage. One-click operation reduces human error and ensures repeatability.
Compact & Modular Design Available in R&D bench-top sizes to high-volume production in-line systems. Easy to integrate into existing cleanroom facilities.

Technical Specifications

Parameter Specification
Coating Materials Cu, Cr, Ti, Ni, Au, Ag, ITO, and various alloys
Substrate Type Alumina (Al₂O₃), Aluminum Nitride (AlN), Zirconia, Quartz, Glass
Sputtering Sources 2–6 Cathodes (RF/DC/Pulsed DC optional)
Substrate Holder Rotation/Planetary for batch processing
Ultimate Pressure ≤ 5.0 × 10⁻⁴ Pa (High vacuum ensures purity)
Uniformity ≤ ±5% (within substrate area)

Why Choose Sputtering Over Traditional Electroplating?

Traditional wet electroplating often struggles with adhesion on ceramic surfaces and generates chemical waste. Our magnetron sputtering system offers a dry, green, and high-precision alternative:

  • No Chemical Waste: 100% dry process, environmentally friendly.

  • Sub-Micron Control: Precise film thickness control for high-frequency circuits and power electronics.

  • Excellent Step Coverage: Uniform coating even on complex 3D ceramic structures.

Applications

This system is ideal for industries requiring high-performance metallization on ceramics:

  • Power Electronics: Direct Bonded Copper (DBC) and Active Metal Brazing (AMB) substrates.

  • Semiconductor Packaging: Ceramic packages, RF filters, and MEMS devices.

  • Automotive Sensors: Ceramic heating elements and thick-film hybrid circuits.

  • Medical Devices: Biocompatible coatings for ceramic implants.

 
Why Partner With Hongfeng VAC?

  • Turnkey Solution: We provide system installation, process recipe development, and local technical training.

  • Global Support: 24/7 remote diagnostics and spare parts supply.

  • Customization: Tailored chamber sizes, load-lock systems, and in-situ cleaning options available.

 
Get a Quote

Looking to enhance your ceramic metallization line?
Contact us today to discuss your specific requirements. We offer free feasibility testing—send us your ceramic substrates, and we’ll show you the results.

Contact us now to optimize your thin-film deposition process.