HIPIMS Power Supply for Magnetron Sputtering Coater
It is used for single-cathode and dual-cathode magnetron sputtering of metal materials, and is particularly suitable for composite material doping, reactive magnetron sputtering, and oxide, nitride, and carbide film deposition, enhancing ionization rates.
Features:
It improves adhesion (flexible substrates such as PET, ceramic metallization, and hard coatings);
It improves film density (hard coatings and decorative plating);
It is suitable for coating special-shaped workpieces (deep hole coatings and special molds);
Its main circuit topology utilizes a PFC+SiC full-bridge architecture, combined with DSP+FPGA digital control technology;
It features constant power/constant current mode switching, with constant power mode ensuring repeatable coating processes;
It features a built-in arc suppression timer to adapt to different target materials and processes, and records arc strikes and allows for querying counts.
Technical Specifications:
Output waveform
