Continuous Lab Inline Sputter Coating Machine
This is a small pilot sputtering machine which is designed for testing or coatings engineering by small scale. It comes with DC sputtering or Mid-frequency(MF) magnetron sputtering guns, with or without ion plasma cleaning system. You could choose planar or rotary cylindrical sputtering cathodes for your application. Both of horizontal and vertical vacuum chambers are available.
It allows you to apply different coatings in multiple layers onto substrates. It can be equipped with diffusion pump or oil-free turbo molecular pumps. It is capable to apply AR coatings, ITO glass, mirrors, or for solar cells.
Continuous Lab Inline Sputter Coating Machine is a special coating equipment for experimental and research purposes, which works based on the principle of magnetron sputtering coating technology. Continuous Lab Inline Sputter Coating Machine is widely used in the laboratories of scientific research institutions and universities for the preparation and research of various thin film materials. Specifically, it can be used to prepare microelectronic elements such as metal wires, metal heat sinks, and photolithographic masks; optical elements such as lenses, filters, and reflectors; and chemical elements such as catalysts and sensors. In addition, it can also be used to improve the surface hardness, wear resistance and corrosion resistance of mechanical parts. Magnetron sputtering coating technology is a kind of coating technology which uses coating material as target cathode, uses argon ion to bombard the target, produces cathode sputtering, and sputters the target atoms onto the workpiece to form a deposition layer. In the sputtering process, electrons collide with argon atoms and ionize them under the action of electric and magnetic fields, producing Ar positive ions and new electrons. Ar positive ions are accelerated to fly to the cathode target under the action of the electric field, and bombard the surface of the target with high energy, so that the target material is sputtered. The sputtered target atoms or molecules are deposited on the surface of the substrate to form the desired film.
Main features
High deposition rate: due to the use of magnetron electrodes, a very large target bombardment ion current can be obtained, so the sputtering etching rate of the target surface and the film deposition rate on the substrate surface are very high.
Excellent film quality: magnetron sputtering coating technology can prepare pure metal or alloy coating with precise and constant proportion, as well as metal reaction film with gas participation, which meets the requirements of film diversity and high precision. Imultaneously, that film lay has no problem of liquid drop particles and has good uniformity.
High flexibility: the working parameters have a large dynamic adjustment range, and the deposition rate and thickness of the coating are easy to control. In addition, almost all metal, alloy and ceramic materials can be made into target materials to meet different experimental needs.
Environmental protection and energy saving: Magnetron sputtering coating technology is an efficient coating method, and the whole process has no waste gas and waste water discharge, which meets the requirements of environmental protection.