Cu Ti TiO2 ZnO PVD System Vacuum Coating Line
Inline PVD System Vacuum Coating Machine has a wide range of applications in the preparation of new electronic materials, optics, solar energy, semiconductors, and other fields.
Characteristics of the coating line:
Fully automatic loading and unloading: The equipment is equipped with a robotic arm to automatically transport substrates, improving production efficiency.
Multi substrate process: Supports simultaneous sputtering coating of multiple substrate materials.
Fully automatic process: Simplify the operation process, achieve one click start and monitoring of the entire production process.
Multi PVD coating chambers: allows for single target and single chamber independent processes, improving production flexibility.
Sputtering target: Provide the number and type of sputtering cathodes according to different coating requirements, both flat and cylindrical sputtering cathodes are available.
Various Coatings:
Including single-layer, multi-layer films, alloy films, oxides, nitrides, carbides, etc.
Target isolation: A special structure is used to isolate the sputtering target, avoiding cross contamination of the target material.
Auxiliary cleaning ion source: optional to improve the adhesion of the film.
There are various power configurations, including DC, RF, DC pulse, DC bias, RF bias, etc.
Substrate heating: Single crystal thin films can be prepared through process control, and heating can be adjusted according to the production process.
High uniformity of thin film deposition layers: Within ± 3% to ± 5%
Vacuum pumping system: optional molecular pump or low-temperature pump to ensure a high vacuum environment.
Technical parameters: including target size, number of targets, substrate size, substrate stage speed, and heating temperature.
Applications:
Suitable for depositing various metal, non-metal, compound and other thin film materials on flat substrates, such as Al, Cu, Au, Pt, Ti, Ni, W, NiCr, TiW, SiO2, Al2O3, TiO2, ZnO, TaN, ITO, etc., suitable for mass production.