Inline Plasma Ashing System
This is an inline system which comes with multiple vacuum chambers. The quanitity of vacuum chambers, magentron cathodes, gas distribution system can be customed according to the processing requirements. A small output system can be made in vertical type and for industrial large scale system can be made in horizontal type.
The system can be used for plasma treatment or with magnetron sputtering/cathodic arc evaporators for thin film deposition applications. Both of turbomolecular pump and diffusion pump options are available.
Magnetron sputtering coating line is an efficient coating production equipment, which combines the advantages of magnetron sputtering technology and multi-vacuum chamber design, and can meet the needs of large-scale and continuous coating production. The working principle of the multi-vacuum chamber magnetron sputtering coating line is based on the magnetron sputtering technology. In a vacuum environment, high-energy ions (such as argon ions) accelerated by an electric field bombard the surface of the target material, sputter out atoms or molecules of the target material, and deposit on the substrate to form the required film. The introduction of the magnetic field causes the electrons to do cyclotron motion near the target material, prolongs the residence time of the electrons, and improves the sputtering efficiency.
Main parts of the inline coating system
The magnetron sputtering coating line is mainly composed of the following parts:
Multiple vacuum chambers: Each vacuum chamber is equipped with an independent vacuum pumping system, which can adjust the gas parameters of each vacuum chamber at will to meet the needs of different coating processes. The vacuum chamber is usually made of stainless steel, and the inner wall is polished to reduce the introduction of impurities.
Coating system: The target is the main material source for coating, and different target materials can be selected as required. The backing plate is used to ensure stable mounting and electrical contact of the target while providing the necessary cooling structure. A magnetic field is generated to guide the electrons to do the cyclotron motion near the target material so as to improve the sputtering efficiency. The intensity, direction and distribution of the magnetic field have an important influence on the sputtering uniformity and target utilization.
Vacuum pump system: It is composed of mechanical pump, roots pump, molecular pump, etc. It is responsible for maintaining the vacuum degree of the vacuum chamber and ensuring the smooth progress of the coating process.
Heating and cooling system: used to control the temperature of the substrate and target to meet the temperature requirements of different coating processes.
Process gas supply system: responsible for filling the required gas into the vacuum chamber, such as argon, nitrogen, etc., to adjust the gas atmosphere during the coating process.
Control system: Touch screen and PLC automatic control are used to realize the automatic control and monitoring of the coating process.