Small Planar Magnetron Sputtering Coating Cathode For Sputter Coater
Planar magnetron sputtering cathode is one of the key components in vacuum sputtering equipment, and its performance significantly affects the quality and efficiency of the deposited films. DC voltage is applied between the cathode (plane target) and the anode (the wall of the coating chamber) by filling a proper amount of argon gas under the condition of high vacuum pressure, so that a magnetic type abnormal glow discharge is generated in the coating chamber. Under the action of the electric field, the electrons fly to the substrate and collide with the argon atoms in the process, so that the argon atoms are ionized to produce Ar positive ions and new electrons. The new electrons continue to fly to the substrate, while the Ar ions are accelerated to fly to the cathode target under the action of the electric field and bombard the surface of the target with high energy to sputter the target material. The sputtered target atoms or molecules are deposited on the substrate to form the desired film. Planar magnetron sputtering cathodes are widely used in the preparation of various thin films, such as metals, semiconductors, insulators and optical films. Its advantages are simple operation, wide coating area, strong adhesion, high speed, low temperature and low damage. By adjusting the sputtering parameters and magnetic field configuration, we can also precisely control of the composition, structure and properties of the thin film coatings.
Features of Hongfeng VAC's small planar magnetron sputtering cathode:
- High deposition rate
- Uniform thin fim coatings
- Very fine deposition coatings
- Suitable for precious metals