Vacuum In-line Sputtering System with Multiple Chambers

Vacuum thin film deposition system can be used for preparing optical thin films, protective films, decorative films etc., has stable process performance and a modular structure, and adopts an industry-leading software control system. Magnetron sputtering coating line is an efficient, flexible and stable coating production equipment, which has a wide range of applications and development potential.
 
The coating process of the multi-vacuum chamber magnetron sputtering coating line generally comprises the following steps: 

 Pretreatment: carry out cleaning, degreasing, derusting and other pretreatment on the substrate to ensure that the surface of the substrate is clean and free of impurities. 
 Vacuum pumping: start the vacuum pump system to pump each vacuum chamber to the required vacuum degree. 
 Heating and cooling: the substrate and the target are heated or cooled according to the requirements of the coating process. 
 Puttering and coating: introducing required gas into a vacuum chamber, applying an electric field and a magnetic field, and depositing target atoms on a substrate by sputtering to form a thin film. 
 Post-treatment: After the coating is completed, the substrate is cooled, cleaned and detected as necessary. 

Advantages

 High efficiency: multiple vacuum chambers can work in parallel, which greatly improves the coating efficiency. 
 Flexibility: Each vacuum chamber can independently adjust the gas parameters and coating process to meet the diverse coating needs. 
 Stability: Advanced control system and stable vacuum environment ensure the stability and consistency of the coating process. 
 Scalability: The number of vacuum chambers can be increased according to production requirements to achieve larger-scale coating production. 
 Environmental protection: There is no waste water and waste gas emission in the coating process, which meets the requirements of environmental protection. 

Technical Specifications
 
Parameter Specification
System Configuration In-line multi-chamber design with load lock, process chambers, and unload lock
Number of Process Chambers Configurable from 2 to 7 chambers (customizable)
Substrate Size Customizable; supports up to 200mm wafers and large-area substrates
Coating Uniformity Better than ±5%
Ultimate Vacuum < 5.0 × 10⁻⁴ Pa (customizable to higher vacuum levels)
Sputtering Cathodes DC, Pulsed DC, and RF magnetron sputtering sources available
Target Configuration Multiple planar or rotary cathodes
Control System PLC integrated with HMI touch screen; fully automatic and semi-automatic modes
Pretreatment Options Glow discharge, RF bias, or ion beam cleaning
Pumping System Turbo molecular pumps with mechanical backing pumps
Power Supply Multiple power supply options for different process requirements
 
Applications

Our Vacuum In-line Sputtering System serves a diverse range of industries and applications-:

🔬 Optical & Display
  • Anti-reflective (AR) coatings for glass and displays

  • Transparent conductive oxides (TCO/ITO)

  • Optical thin films and filters-

  • Automotive display cover glass

🏭 Industrial & Decorative
  • Decorative metallic finishes

  • Wear-resistant and hard protective coatings

  • Electromagnetic interference (EMI) shielding

  • Architectural glass coatings

⚡ Electronics & Semiconductor
  • Wafer metallization

  • MEMS and semiconductor device fabrication-

  • Thin film deposition for power devices

  • Photovoltaic cell contacts

🏥 Medical & Specialty
  • 3D medical device coatings

  • Composite dielectric coatings

  • High-purity thin films for research applications